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SGC 
Plating resist SGC-2500, 2700 is an alkaline removal heat curable plating resist ink and suitable for plating resist of selective board.
SGC-2500 is available to alkaline removal even after hot press in long time and high temperature as well as overcoming a stepped difference between rigid and flexible board after hot press application.
SGC-2700 is very useful for pattern protection in temporary bonding application.
| Division | SGC-2500 | SGC-2700 |
|---|---|---|
| Color | Transparent | White |
| Viscosity(25˚C, VT-04F)PS | 150 ~ 250 | |
| Curing condition | More than 150˚C X 50 min | |
| Removability of coating film | 2~5% NaOH water solution, 50˚C | |
| Shelf life(20˚C in a dark Place) | 6 months | |
| Major Features | Excellent alkaline removing after hot press |
Flexibility Excellent plating resist |
* Packing Unit : 1 Kg
SFR
This is two-components type paste for insulation coating and solder resistance. It is most suitable for PI and PET film because it has excellent adhesion, humidity resistance, flexibility, soldering resistance, and easy operation. SFR-300 Series shall be recommendable to a part required by superior soldering resistance.
| Division | SFR-300PI□ | SFR-200PI□ | SFR-500 |
|---|---|---|---|
| Color | Y=Yellow , B= Blue, C=Black, T=Transparent | Green, Brown, Black | |
| Viscosity(25˚C, VT-04F)PS After mixing | 50 ~ 120 | 250 ~ 400 | 150~300 |
| Pot-life after the mixing at 20˚C | 24hr | ||
| Curing condition | 130 ~ 150˚C X 10~30min | 130˚C : 10min over (PI) 100˚C : 25min over (PET) 90˚C : 30min over (PET) |
150˚C X 30~60 min |
| Pencil hardness | H | ||
| Adhesion | 100/100 (PET), 100/100 (PI) , 100/100 (Cu) | ||
| After 180degrees bending spread 1 times Redundant twice spread Additional 180˚C heat, 24 minutes and one times |
20 to 25 times Micro Cracked outbreak 15 to 20 times Micro Cracked outbreak 15 to 20 times Micro Cracked outbreak |
||
| Resistance to molten solder | 260˚C X 10sec, 1 time | 260˚C X 10sec, 3 times | |
| Surface resistance (40˚C, 90% RH, 240hr) |
1011Ω | ||
| Shelf life(20˚C in a dark Place) | 6 Months | 1 Month | |
| Major Features | Flexibility, Overcoating Paste |
Low Temperature Curing, Excellent adhesion |
Bendability |
* Packing Unit : 1, 4 Kg
SSM-202B
SSM-202B is solder masking material to be coated on the lands where soldering is temporarily not required.
This is suitable strip mask on the carbon contact switch.
| Division | SSM-202B |
|---|---|
| Color | Blue paste |
| Viscosity(25˚C, VT-04F)PS | 400 ~ 500 |
| Curing condition | 150˚C X 10~20 min |
| Resistance to Molten solder | 260˚C X 10 sec, 3times |
| Resistance to reflow | 230˚C X 10 sec, 3times |
| Pencil hardness | ≥ H |
| Electric Insulation resistance | 3 X 1010Ω |
| Application | Strip Mask |
| Shelf life(20˚C in a dark Place) | 6 months |
| Major Features | Peelable Easy Process |
* Packing Unit : 1 Kg
SHP
This product is Halogen Free and permanent via plugging paste. It is one component type for via plugging operation, polishing and thermal specificity. And also, it is non-volatile solvent, voids or shrinkage is decreased extremely.
| Division | SHP-10HF |
|---|---|
| Color | Green, White |
| Viscosity(25˚C, VT-04F)PS | 400 ~ 500 |
| Thixotropy Index HBT(ŋ1/ŋ100) |
10~20 |
| Curing condition | 150˚C X 30 min |
| Post Curing condition | 150˚C X 60 min |
| Acid Resistance 10vol.% H₂SO₄, 20˚C | No damage |
| Alkali resistance 5wt% NaOH, 20˚C | No damage |
| Solvent Resistance Methylenechloride, 20˚C |
No damage |
| Glass Transition Temperature (TMA method) |
160˚C |
| Coefficient of Linear expansion |
50ppm(≤Tg) 70ppm(≤Tg) |
| Shelf life( ≤ 10˚C in a dark Place) | 1 month |
| Major Features | Permanent Via Hole Plugging |
* Packing Unit : 1 Kg
PF-501
This is suitable for protecting the copper foil the overall coating of printed circuit boards.
| Division | PF-501 |
|---|---|
| State | Liquid |
| Color | Light yellow |
| Density | 0.985 |
| Solid contents(wt%) | 47 |
| Chlorine content (%) | 0 |
| Softening point | 150˚C |
| Shelf life (20˚C in a dark place) | 6 months |
* Packing Unit : 15 Kg
SH-205
SH-205 is suitable for removing all contaminants such as oil finger prints and oxides from the copper surface on PCBs.
| Division | SH-205 |
|---|---|
| Color | White powder |
| Density (20˚C) | 0.963 |
| Application | Reduce 10 times by water rinse afterward |
| Shelf life (20˚C in a dark place) | 6 months |
* Packing Unit : 20 Kg
