Home >
COMPANY >
History
COMPANY
- SCRL
- Please feel free to contact us by online for inquiry.
- +82-31-499-0321
- E-mail. inka23@scrl.co.kr
History
1983
~
1999
-
1999
- 05
- Selected venture enterprise by SMBA(Small and Medium Business Administration)
- 10
- An assigned company for special resources and functional workers replace for military service
-
1998
- 04
- Selected promise small and medium industry office(Gyeonggi-do)
- 07
- Acquired the certification for ISO 9001
- 10
- Authorization of an Annex research institute establishment
- 10
- Listed on the patent (No.0280925)
[2-Nitrothioxanthone manufacture method]
- 11
- Listed on the patent (No.0300880)
[2-Aminonthioxanthone manufacture method]
-
1997
- 02
- Acquired the certification of U/L (E99647)
- Liquid Photoimageable Solder Resist (SPI-707G)
-
1993
- 06
- Incorporated a firm as “SEOUL CHEMICAL RESEARCH LABORATORY CO.,LTD”
-
1987
- 11
-
Acquired the certification of U/L (E99647)
- UV Curable Solder Resist (SUR-900G)
Heat Curable Solder Resist (SCR-505G)
-
1983
- 03
- Founded as SEOUL CHEMICAL RESEARCH LABORATORY
2000
~
2009
-
2008
- 02
- Completed Gunsan Factory
- 03
- Development of White PSR/UV/IR ink for LED PCB
-
2007
- 02
- Development of hole-filling ink(SHP-10)
- 04
- Contract Sony Green Partnership
-
2006
- 01
- Selected INNO-BIZ enterprise by SMBA(Small and Medium Business Administration)
- 03
- Acquired the certification of U/L - Flexible Liquid Photoimageable Ink. (SPI-606G)
- 08
- Development of SILVER PASTE for EMI(SSP-140)
- 09
- Development of FLEXIBLE OVER COATING INK (SFR-300)
-
2004
- 12
- Acquired the certification of U/L (E99647) - Liquid Photoimageable Solder Resist(SPI-707 All Item)
-
2002
- 06
- Acquired the certification for ISO 14001
- 07
- Selected export small and medium enterprise of great promise
2010
~
Now
-
2023
- 04
- Development of Low-Dielectric Photoimageable Solder Resist Ink (Patent Registration)
-
2022
- 08
- Development of Etching Resist Ink For Inkjet
-
2019
- 12
- Development of High-sensitivity Photo-curable Ink
(Flexible Ink for Direct Imaging)
- 01
- Development of UV-curable 1-Degree Printing
LED White Solder Resist Ink
-
2018
- 10
- Development of Spray-type Photo-curable Ink
-
2016
- 05
- Development of Heat-curable Solder Resist Ink for Solar Cells
-
2015
- 12
- Development of Photo-curable Ink for Tin Plating for Soldering
-
2014
- 02
- Development of F-PCB BENDING Ink (SFR-500□)
- 05
- Development of CARBON PASTE for volume
(SCV-□)
-
2013
- 02
- Development of SILVER PASTE for TSP fine pattern(STP-170)
-
2012
- 12
- Development of TSP glass-protecting ink
-
2011
- 05
- Acquired the certification of U/L - FLEXIBLE Liquid Photoimageable Ink. (SPI-606 All Color)
-
2010
- 09
- Development of TSP SILVER PASTE (STP-240)
