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Liquid Photoimageable Ink
SPI-707 
This is an alkaline developing type of liquid solder resist ink. It is suitable for various kind of PCB surface treatment such as HASL, ENIG, Tin plating, and OSP with outstanding resolution and adhesion
| Division | SPI-707 | ||||
|---|---|---|---|---|---|
| General Type | TC | TN | TN-21 | TN-31 | HK |
| Halogen-Free Type | HFTC | HFTN | HFN | HFTN31 | HFHK |
| Color |
Green, Blue, S Blue, RED, Black White, Brown, D-yellow, Clear |
Green | White | ||
| Viscosity(25˚C, VT-04F) | 150~200 PS | ||||
| Pencil hardness | ≥ 6H(Matt Type : ≥ 5H) | ||||
| Adhesion (Cross-cut) | 100 / 100 | ||||
| Resistance to molten solder | 260˚C X 10sec, 3times | ||||
| Finish treatment | HASL/TIN/ENIG | ||||
| Resolution 40㎛, 400mJ/cm2 |
60㎛ | 60㎛ | 50㎛ | 50㎛ | 80㎛ |
| 10vol% H₂SO₄, 20˚C : Acid resistance 5wt% NaOH, 20˚C : Alkali-resistance |
≥ 30min | ||||
| Surface Resistance (40˚C, 90% RH, 240hr) |
≥ 1 X 10 13 | ||||
| ≥ 1 X 10 12 | |||||
| Shelf life(20˚C in a dark Place) | 6 months | ||||
| Major Features | General | Excellent HAST test | High Resolution | High Resolution, Electroless Gold Plating |
High thermal conductivity |
* Packing Unit : 1, 4 Kg
SPI-707PKG
| Division | SPI-707 PKG | |
|---|---|---|
| Color | Green, Blue, Black | |
| Pencil hardness | ≥4H | |
| Resistance to molten solder | 260˚C X 10sec, 3times | |
| Electroless gold plating | Ni 3㎛. Au 0.03㎛ | |
| PCT resistance | 2atm, 100% RH, 121˚C, 96hr | |
| HAST(130˚C/85% RF/96hr) | Initial value ≥ 1 X 1013Ω | Conditioned ≥ 1 X 10 12Ω |
| CTE | Below Tg 50 ~ 60ppm | Above Tg 140 ~ 150ppm |
| Shelf life(20˚C in a dark Place) | 6 months | |
| Major Features | High Resolution, High Reliability | |
* Packing Unit : 1, 4 Kg
SPI-606
This is an alkaline developing type of liquid solder resist ink. This is most suitable for flexible printed circuit boards.
| Division | SPI-606 Series | SFR-600 | SUF-20□ |
|---|---|---|---|
| Color | Green, Yellow, S Blue, Black | Green, White | Transparent, Green, Blue, Black |
| Viscosity(25˚C, VT-04F) PS | 150~250 | 200~350 | 80~150 |
| Pot-life after the mixing at 20˚C | 8 hr | 24hr | 24hr |
| Pencil hardness | ≥ 4H | ≥2H | |
| Adhesion (JIS D0202) |
100/100 (PET) 100/100 (PI) 100/100 (Cu) |
||
| Curing condition |
400~700mJ 150˚CX 50 min |
120˚C X 60~90 min | UV Curing(1500mJ) |
| Resistance to molten solder |
260˚C X 10sec , 3times | 260˚C X 5sec , 1times | |
| Flexicility (after 180degrees bending) | No Crack(1 pass) | ||
| Acid Resistance (10Vol% H₂SO₄, 20˚C) |
≥ 30 min | ||
| Alkali Resistance (5wt% NaOH, 20˚C) |
≥ 30 min | ||
| Electroless gold plating | Passed ( Ni 3㎛ , Au 0.03㎛) |
- | - |
| Surface Resistance (40˚C, 90% RH, 240hr) |
1011Ω | ||
| Shelf life(20˚C in a dark Place) | 6 months | ||
| Major Features | Flexible PSR Ink | Excellent Adhesion Plating Resist(Ni/Ag) | Flexible UV Ink |
* Packing Unit : 1, 4 Kg
SPE-60
SPE-60 is an alkaline developing type of photoimageable etching resist ink which has been developed to substitute dry film.
| Division | SPE-60 / SPE-60S | SPE-60S PR |
|---|---|---|
| Color | Clear(before Curing) ⇒ Violet(after curing) |
Blue |
| Viscosity(25°C, VT-04F) | 40~100 | |
| Photo Exposure | 30~100mJ/cm 2 | |
| Resolution ( 50~100mJ/cm2) | 15~25 | |
| Pencil hardness | ≥ 2H | |
| Removability of coating film (5wt% NaOH, 50°C) |
30 ~ 60 sec | |
| Shelf life(20°C in a dark Place) | 6 months | |
| Major Features | High resolution, easily removable by alkali, Excellent acid resistance |
Substitution for Dry film Fine Pattern (Resolution 20/20㎛) TSP |
* Packing Unit : 1, 4 Kg
